W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 70
W25Q32BVSSIG
Manufacturer Part Number
W25Q32BVSSIG
Description
IC SPI FLASH 32MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q32BVZPIG.pdf
(79 pages)
Specifications of W25Q32BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
Winbond
Quantity:
1 000
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
WINBOND
Quantity:
9 310
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
Winbond
Quantity:
6 600
Part Number:
W25Q32BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
9.1
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
9. PACKAGE SPECIFICATION
8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
e
A1
A2
D1
E1
A
C
D
E
H
b
L
θ
y
(2)
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
MILLIMETERS
1.27 BSC.
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
- 70 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
Min
---
0°
0.050 BSC.
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
---
---
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
Max
8°
W25Q32BV
GAUGE PLANE
GAUGE PLANE