W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 73

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SYMBOL
M
N
P
Q
R
Min
MILLIMETERS
SOLDER PATTERN
Nom
3.40
4.30
6.00
0.50
0.75
- 73 -
Max
Min
Publication Release Date: April 01, 2011
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
W25Q32BV
Revision F