W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 9

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.7
3.8
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
BALL NO.
Multiple
C2
C4
D2
D3
D4
B2
B3
B4
Ball Configuration TFBGA 8x6-mm
Ball Description TFBGA 8x6-mm
/HOLD (IO3)
Figure 1e. W25Q32BV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TC)
PIN NAME
/WP (IO2)
DO (IO1)
DI (IO0)
GND
VCC
CLK
/CS
NC
I/O
I/O
I/O
I/O
I/O
I
I
C1
D1
A1
NC
B1
NC
NC
NC
E1
NC
F1
NC
Ground
Power Supply
Chip Select Input
Write Protect Input (Data Input Output 2)*
Hold Input (Data Input Output 3)*
No Connect
DO(IO
Serial Clock Input
Data Output (Data Input Output 1)*
Data Input (Data Input Output 0)*
Top View
CLK
/CS
NC
C2
D2
NC
NC
A2
B2
E2
F2
1
)
- 9 -
DI(IO
GND
A3
NC
B3
C3
NC
D3
E3
NC
NC
F3
0
)
/HOLD(IO
/WP (IO
VCC
A4
NC
B4
C4
D4
E4
NC
F4
NC
2
)
3
)
FUNCTION
Publication Release Date: April 01, 2011
2
1
1
2
W25Q32BV
Revision F