W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 56

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

7.2.35 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q32BV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low
and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and
two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling
edge of CLK with most significant bit (MSB) first as shown in Figure 33. For memory type and capacity
values refer to Manufacturer and Device Identification table.
(IO
(IO
(IO
(IO
CLK
CLK
/CS
/CS
DO
DO
DI
DI
0
1
0
1
)
)
)
)
Mode 3
Mode 0
15
*
*
7
= MSB
16
6
17
0
Memory Type ID15-8
5
18
1
Figure 33. Read JEDEC ID Instruction Sequence
4
19
Instruction (9Fh)
High Impedance
2
3
20
3
2
21
4
1
22
5
- 56 -
0
23
6
*
7
24
7
6
25
8
5
26
Capacity ID7-0
9
Manufacturer ID (EFh)
4
27
10
3
28
11
2
29
12
1
30
13
0
W25Q32BV
14
Mode 3
Mode 0
15