W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 66

• Manufacturer Part Number: W25Q32BVSSIG
• Description: IC SPI FLASH 32MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.5 AC Measurement Conditions
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
PARAMETER
Load Capacitance
Input Rise and Fall Times
Input Pulse Voltages
Input Timing Reference Voltages
Output Timing Reference Voltages
Input Levels
0.8 VCC
0.2 VCC
Figure 39. AC Measurement I/O Waveform
SYMBOL
T
- 66 -
O
R
V
C
IN
, T
UT
IN
L
F
Timi
I
ng Reference Levels
nput and Output
MIN
0.2 VCC to 0.8 VCC
0.3 VCC to 0.7 VCC
0.5 VCC to 0.5 VCC
0.5 VCC
SPEC
MAX
30
5
W25Q32BV
UNIT
pF
ns
V
V
V