SE98ATP,547 NXP Semiconductors, SE98ATP,547 Datasheet - Page 2

• Manufacturer Part Number: SE98ATP,547
• Description: IC TEMP SENSOR DDR 8-HWSON
• Manufacturer: NXP Semiconductors

Specifications of SE98ATP,547

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 1.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WSON (Exposed Pad), 8-HWSON
• Temperature Threshold: Programmable
• Full Temp Accuracy: +/- 1 C
• Digital Output - Bus Interface: 2-Wire, SMBus, I2C
• Digital Output - Number Of Bits: 11
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.7 V
• Description/function: DDR Memory Module Temperature Sensor
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Current: 250 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4731-2; SE98ATP,147

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
[1]
SE98A_4
Product data sheet
Type number
SE98APW
SE98ATP
SE98ATL
Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
[1]
Ordering information
Topside
mark
S98A
98A
8AL
Operating current: 250 μA (typ.) and 400 μA (max.)
Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C
Over/under/critical temperature EVENT output
B grade accuracy:
ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Available packages: TSSOP8, HWSON8 (PSON8 VCED-3) and HXSON8
DDR2 and DDR3 memory modules
Laptops, personal computers and servers
Enterprise networking
Hard disk drives and other PC peripherals
Package
Name
TSSOP8
HWSON8
HXSON8
±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C
±1 °C/±2 °C (typ./max.) → +40 °C to +125 °C
±2 °C/±3 °C (typ./max.) → −40 °C to +125 °C
Description
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.5 mm
Rev. 04 — 25 November 2009
DDR memory module temp sensor, 1.7 V to 3.6 V
© NXP B.V. 2009. All rights reserved.
SE98A
Version
SOT530-1
SOT1069-2
SOT1052-1
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