SE98ATP,547 NXP Semiconductors, SE98ATP,547 Datasheet - Page 30

• Manufacturer Part Number: SE98ATP,547
• Description: IC TEMP SENSOR DDR 8-HWSON
• Manufacturer: NXP Semiconductors

Specifications of SE98ATP,547

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 1.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WSON (Exposed Pad), 8-HWSON
• Temperature Threshold: Programmable
• Full Temp Accuracy: +/- 1 C
• Digital Output - Bus Interface: 2-Wire, SMBus, I2C
• Digital Output - Number Of Bits: 11
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.7 V
• Description/function: DDR Memory Module Temperature Sensor
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Current: 250 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4731-2; SE98ATP,147

NXP Semiconductors
Table 26.
V
[1]
SE98A_4
Product data sheet
Symbol
V
V
V
V
V
I
I
I
I
I
C
OL(sink)EVENT
OL(sink)(SDA)
LOH
LIH
LIL
DD
Fig 16. Average supply current
IH
IL
I(ov)
th(POR)H
th(rec)POR
i
I
High-voltage input voltage applied to pin A0 during RWP and CRWP operations of the equivalent SPD-included parts. The JEDEC
specification is 7 V (min.) and 10 V (max.). When V
8.4 V.
= 1.7 V to 3.6 V; T
DD(AV)
(μA)
a. I
350
250
150
50
−50
2
V
SMBus DC characteristics
C-bus inactive
DD
−25
= 3.6 V
Parameter
HIGH-level input voltage
LOW-level input voltage
overvoltage input voltage
HIGH-level power-on reset
threshold voltage
power-on reset recovery
threshold voltage
LOW-level output sink current on
pin EVENT
LOW-level output sink current on
pin SDA
HIGH-level output leakage current
HIGH-level input leakage current
LOW-level input leakage current
input capacitance
3.0 V
2.3 V
1.7 V
0
amb
=
25
−
20
50
°
C to +120
75
T
amb
002aae374
100
°
C; unless otherwise specified. These specifications are guaranteed by design.
(°C)
Rev. 04 — 25 November 2009
125
DD
is 3.6 V, then V
Conditions
SCL, SDA;
V
SCL, SDA;
V
pin A0;
V
for device reset
V
V
V
pins SCL, SDA;
V
pins SCL, SDA;
V
SCL, SDA pins
DD
DD
I(ov)
OL
OL
OH
I
I
= V
= V
= 0.4 V
= 0.5 V
= 1.7 V to 3.6 V
= 1.7 V to 3.6 V
= V
− V
DD
DD
DD
DD
or V
or V
I(ov)
DDR memory module temp sensor, 1.7 V to 3.6 V
I
DD(AV)
> 4.8 V
(μA)
SS
SS
b. I
350
250
150
> 4.8 V + V
50
−50
2
V
C-bus active
DD
−25
= 3.6 V
3.0 V
2.3 V
1.7 V
DD
[1]
or > 4.8 V + 3.6 V then the minimum voltage is
Min
0.7V
-
7.0
-
-
6
3
-
−1.0
−1.0
-
0
DD
25
Typ
-
-
-
-
-
-
-
-
-
5
-
50
75
© NXP B.V. 2009. All rights reserved.
T
amb
Max
V
0.3V
10
1.7
-
-
1.0
+1.0
+1.0
10
002aae375
0.5
100
DD
SE98A
(°C)
+ 1
DD
125
Unit
V
V
V
V
V
mA
mA
μA
μA
μA
pF
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