SE98ATP,547 NXP Semiconductors, SE98ATP,547 Datasheet - Page 43

• Manufacturer Part Number: SE98ATP,547
• Description: IC TEMP SENSOR DDR 8-HWSON
• Manufacturer: NXP Semiconductors

Specifications of SE98ATP,547

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 1.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WSON (Exposed Pad), 8-HWSON
• Temperature Threshold: Programmable
• Full Temp Accuracy: +/- 1 C
• Digital Output - Bus Interface: 2-Wire, SMBus, I2C
• Digital Output - Number Of Bits: 11
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.7 V
• Description/function: DDR Memory Module Temperature Sensor
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Current: 250 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4731-2; SE98ATP,147

NXP Semiconductors
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
7.3.2.2
7.3.3
7.3.3.1
7.3.3.2
7.4
7.4.1
7.5
7.6
7.7
7.8
7.9
7.10
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . 16
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5
EVENT output condition . . . . . . . . . . . . . . . . . . 6
EVENT pin output voltage levels and resistor
sizing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 8
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Event operation modes. . . . . . . . . . . . . . . . . . . 9
Comparator mode. . . . . . . . . . . . . . . . . . . . . . . 9
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . 9
Conversion rate . . . . . . . . . . . . . . . . . . . . . . . 10
What temperature is read when conversion
is in progress . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up default condition . . . . . . . . . . . . . . . 11
Device initialization . . . . . . . . . . . . . . . . . . . . . 11
SMBus Time-out . . . . . . . . . . . . . . . . . . . . . . . 12
SMBus ALERT . . . . . . . . . . . . . . . . . . . . . . . . 12
SMBus/I
Hot plugging . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Register overview . . . . . . . . . . . . . . . . . . . . . . 16
Capability register
(00h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 17
Configuration register
(01h, 16-bit read/write) . . . . . . . . . . . . . . . . . . 18
Temperature format . . . . . . . . . . . . . . . . . . . . 21
Temperature Trip Point registers . . . . . . . . . . 22
Upper Boundary Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 22
Lower Boundary Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 23
Critical Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 23
Temperature register (16-bit read-only) . . . . . 24
Manufacturer’s ID register
(16-bit read-only) . . . . . . . . . . . . . . . . . . . . . . 25
2
C-bus interface . . . . . . . . . . . . . . . . 13
8.8
8.9
9
9.1
9.2
9.3
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
DDR memory module temp sensor, 1.7 V to 3.6 V
Application design-in information . . . . . . . . . 27
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 29
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 29
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 35
Soldering of SMD packages . . . . . . . . . . . . . . 38
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
Revision history . . . . . . . . . . . . . . . . . . . . . . . 41
Legal information . . . . . . . . . . . . . . . . . . . . . . 42
Contact information . . . . . . . . . . . . . . . . . . . . 42
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Device ID register . . . . . . . . . . . . . . . . . . . . . 25
SMBus register . . . . . . . . . . . . . . . . . . . . . . . 26
SE98A in memory module application . . . . . . 28
Layout consideration . . . . . . . . . . . . . . . . . . . 28
Thermal considerations . . . . . . . . . . . . . . . . . 28
Introduction to soldering. . . . . . . . . . . . . . . . . 38
Wave and reflow soldering. . . . . . . . . . . . . . . 38
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 38
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 39
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Date of release: 25 November 2009
Document identifier: SE98A_4
All rights reserved.
SE98A