MC9S08SH4CTJ Freescale Semiconductor, MC9S08SH4CTJ Datasheet - Page 17

• Manufacturer Part Number: MC9S08SH4CTJ
• Description: IC MCU 8BIT 4K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SH4CTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP
• Processor Series: S08SH
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO, DEMO9S08SH32, DEMO9S08SH8
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 1.05 mm
• Length: 6.6 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Width: 4.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Section Number
17.3 On-Chip Debug System (DBG) ....................................................................................................277
17.4 Register Definition ........................................................................................................................281
A.1 Introduction ...................................................................................................................................289
A.2 Parameter Classification ................................................................................................................289
A.3 Absolute Maximum Ratings ..........................................................................................................289
A.4 Thermal Characteristics .................................................................................................................291
A.5 ESD Protection and Latch-Up Immunity ......................................................................................293
A.6 DC Characteristics .........................................................................................................................294
A.7 Supply Current Characteristics ......................................................................................................298
A.8 External Oscillator (XOSC) Characteristics .................................................................................301
A.9 Internal Clock Source (ICS) Characteristics .................................................................................303
A.10 Analog Comparator (ACMP) Electricals ......................................................................................305
A.11 ADC Characteristics ......................................................................................................................306
A.12 AC Characteristics .........................................................................................................................309
A.13 FLASH Specifications ...................................................................................................................315
A.14 EMC Performance .........................................................................................................................316
B.1 Ordering Information ....................................................................................................................319
B.2 Mechanical Drawings ....................................................................................................................320
Freescale Semiconductor
17.2.2 Communication Details ..................................................................................................270
17.2.3 BDC Commands .............................................................................................................274
17.2.4 BDC Hardware Breakpoint .............................................................................................276
17.3.1 Comparators A and B ......................................................................................................277
17.3.2 Bus Capture Information and FIFO Operation ...............................................................277
17.3.3 Change-of-Flow Information ..........................................................................................278
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................278
17.3.5 Trigger Modes .................................................................................................................279
17.3.6 Hardware Breakpoints ....................................................................................................281
17.4.1 BDC Registers and Control Bits .....................................................................................281
17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................283
17.4.3 DBG Registers and Control Bits .....................................................................................284
A.12.1 Control Timing ...............................................................................................................309
A.12.2 TPM/MTIM Module Timing ..........................................................................................311
A.12.3 SPI ...................................................................................................................................312
A.14.1 Radiated Emissions .........................................................................................................316
A.14.2 Conducted Transient Susceptibility ................................................................................316
B.1.1 Device Numbering Scheme ............................................................................................319
Ordering Information and Mechanical Drawings
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Electrical Characteristics
Appendix A
Appendix B
Title
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