MC9S08SH4CTJ Freescale Semiconductor, MC9S08SH4CTJ Datasheet - Page 291

• Manufacturer Part Number: MC9S08SH4CTJ
• Description: IC MCU 8BIT 4K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SH4CTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP
• Processor Series: S08SH
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO, DEMO9S08SH32, DEMO9S08SH8
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 1.05 mm
• Length: 6.6 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Width: 4.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
Freescale Semiconductor
1
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Junction to Ambient Natural Convection
Num
Thermal Characteristics
1
2
3
4
SS
or V
—
D
D
C
DD
I/O
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and multiply by the pin current for each I/O pin. Except in cases of unusually high
into account in power calculations, determine the difference between actual pin
Single-layer board
Four-layer board
8-pin NB SOIC
16-pin TSSOP
20-pin PDIP
20-pin TSSOP
24-pin QFN
8-pin NB SOIC
16-pin TSSOP
20-pin PDIP
20-pin TSSOP
24-pin QFN
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Table A-3. Thermal Characteristics
Rating
1,2
1,2
M
C
Symbol
θ
θ
T
T
JA
JA
A
J
SS
or V
DD
Appendix A Electrical Characteristics
–40 to 125
–40 to 85
T
will be very small.
L
Value
135
167
123
115
110
115
68
75
49
76
42
to T
H
°C/W
°C/W
Unit
°C
°C
291