MC9S08SH4CTJ Freescale Semiconductor, MC9S08SH4CTJ Datasheet - Page 32

• Manufacturer Part Number: MC9S08SH4CTJ
• Description: IC MCU 8BIT 4K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SH4CTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP
• Processor Series: S08SH
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO, DEMO9S08SH32, DEMO9S08SH8
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 1.05 mm
• Length: 6.6 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Width: 4.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 3 Modes of Operation
Background commands are of two types:
The active background mode is used to program a bootloader or user application program into the FLASH
program memory before the MCU is operated in run mode for the first time. When the MC9S08SH8 is
shipped from the Freescale Semiconductor factory, the FLASH program memory is erased by default
unless specifically noted so there is no program that could be executed in run mode until the FLASH
memory is initially programmed. The active background mode can also be used to erase and reprogram
the FLASH memory after it has been previously programmed.
For additional information about the active background mode, refer to the
3.5
Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT instruction, the CPU
enters a low-power state in which it is not clocked. The I bit in CCR is cleared when the CPU enters the
wait mode, enabling interrupts. When an interrupt request occurs, the CPU exits the wait mode and
resumes processing, beginning with the stacking operations leading to the interrupt service routine.
While the MCU is in wait mode, there are some restrictions on which background debug commands can
be used. Only the BACKGROUND command and memory-access-with-status commands are available
when the MCU is in wait mode. The memory-access-with-status commands do not allow memory access,
but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND
command can be used to wake the MCU from wait mode and enter active background mode.
3.6
One of two stop modes is entered upon execution of a STOP instruction when STOPE in SOPT1. In any
stop mode, the bus and CPU clocks are halted. The ICS module can be configured to leave the reference
clocks running. See
32
•
•
Non-intrusive commands, defined as commands that can be issued while the user program is
running. Non-intrusive commands can be issued through the BKGD/MS pin while the MCU is in
run mode; non-intrusive commands can also be executed when the MCU is in the active
background mode. Non-intrusive commands include:
— Memory access commands
— Memory-access-with-status commands
— BDC register access commands
— The BACKGROUND command
Active background commands, which can only be executed while the MCU is in active background
mode. Active background commands include commands to:
— Read or write CPU registers
— Trace one user program instruction at a time
— Leave active background mode to return to the user application program (GO)
Wait Mode
Stop Modes
Chapter 10, “Internal Clock Source
MC9S08SH8 MCU Series Data Sheet, Rev. 3
(S08ICSV2),” for more information.
Development Support
Freescale Semiconductor
chapter.