MC9S08DZ60ACLF Freescale Semiconductor, MC9S08DZ60ACLF Datasheet - Page 151

IC MCU 60K FLASH 4K RAM 48-LQFP

MC9S08DZ60ACLF

Manufacturer Part Number
MC9S08DZ60ACLF
Description
IC MCU 60K FLASH 4K RAM 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08DZ60ACLF

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
S08DZ
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
For Use With
DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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8.4.3
The BDIV bits can be changed at anytime and the actual switch to the new frequency will occur
immediately.
8.4.4
The low power bit (LP) is provided to allow the FLL or PLL to be disabled and thus conserve power when
these systems are not being used. However, in some applications it may be desirable to enable the FLL or
PLL and allow it to lock for maximum accuracy before switching to an engaged mode. Do this by writing
the LP bit to 0.
8.4.5
When IRCLKEN is set the internal reference clock signal will be presented as MCGIRCLK, which can be
used as an additional clock source. The MCGIRCLK frequency can be re-targeted by trimming the period
of the internal reference clock. This can be done by writing a new value to the TRIM bits in the MCGTRM
register. Writing a larger value will decrease the MCGIRCLK frequency, and writing a smaller value to
the MCGTRM register will increase the MCGIRCLK frequency. The TRIM bits will effect the MCGOUT
frequency if the MCG is in FLL engaged internal (FEI), FLL bypassed internal (FBI), or bypassed low
power internal (BLPI) mode. The TRIM and FTRIM value is initialized by POR but is not affected by other
resets.
Until MCGIRCLK is trimmed, programming low reference divider (RDIV) factors may result in
MCGOUT frequencies that exceed the maximum chip-level frequency and violate the chip-level clock
timing specifications (see the
If IREFSTEN and IRCLKEN bits are both set, the internal reference clock will keep running during stop
mode in order to provide a fast recovery upon exiting stop.
8.4.6
The MCG module can support an external reference clock with frequencies between 31.25 kHz to 5 MHz
in FEE and FBE modes, 1 MHz to 16 MHz in PEE and PBE modes, and 0 to 40 MHz in BLPE mode.
When ERCLKEN is set, the external reference clock signal will be presented as MCGERCLK, which can
be used as an additional clock source. When IREFS = 1, the external reference clock will not be used by
the FLL or PLL and will only be used as MCGERCLK. In these modes, the frequency can be equal to the
maximum frequency the chip-level timing specifications will support (see the
If EREFSTEN and ERCLKEN bits are both set or the MCG is in FEE, FBE, PEE, PBE or BLPE mode,
the external reference clock will keep running during stop mode in order to provide a fast recovery upon
exiting stop.
If CME bit is written to 1, the clock monitor is enabled. If the external reference falls below a certain
frequency (f
bit in the System Reset Status (SRS) register will be set to indicate the error.
Freescale Semiconductor
Bus Frequency Divider
Low Power Bit Usage
Internal Reference Clock
External Reference Clock
loc_high
or f
loc_low
depending on the RANGE bit in the MCGC2), the MCU will reset. The LOC
Device Overview
MC9S08DZ60 Series Data Sheet, Rev. 4
chapter).
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
Device Overview
chapter).
151

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