MC9S08DZ60ACLF Freescale Semiconductor, MC9S08DZ60ACLF Datasheet - Page 25

• Manufacturer Part Number: MC9S08DZ60ACLF
• Description: IC MCU 60K FLASH 4K RAM 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08DZ60ACLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: S08DZ
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 2
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• For Use With: DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

EXTAL
Freescale Semiconductor
* The fixed frequency clock (FFCLK) is internally
synchronized to the bus clock and must not exceed one half
of the bus clock frequency.
XOSC
MCG
1 kHZ
LPO
XTAL
MCGFFCLKVALID
MCGERCLK
MCGIRCLK
MCGFFCLK
MCGOUT
MCGLCLK
CPU
Figure 1-2. MC9S08DZ60 System Clock Distribution Diagram
÷
÷
2
2
BUSCLK
RTC
MC9S08DZ60 Series Data Sheet, Rev. 4
1
0
COP
BDC
TPM1CLK
TPM1
FFCLK*
TPM2CLK
TPM2
IIC
ADC has min and
max frequency
requirements.See
the ADC chapter and
electricals appendix
for details.
ADC
SCI1
MSCAN
Chapter 1 Device Overview
SCI2
Flash and
EEPROM have
frequency
requirements for
program and
erase operation.
See the
electricals
appendix for
details.
FLASH
SPI
EEPROM
25