DSPIC30F6011-30I/PF Microchip Technology, DSPIC30F6011-30I/PF Datasheet - Page 214

• Manufacturer Part Number: DSPIC30F6011-30I/PF
• Description: IC DSPIC MCU/DSP 132K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6011-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Program Memory Size: 132KB (44K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 52
• Flash Memory Size: 132KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 52
• Interface Type: 3-Wire/CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F601130IPF

dsPIC30F6011/6012/6013/6014
64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70117F-page 212
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MS-026
Drawing No. C04-066
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
See ASME Y14.5M
p
c
Dimension Limits
#leads = n1
E1
E
Units
(F)
A2
A1
E1
D1
n1
A
E
D
B
n
p
L
c
MIN
n
.037
.002
.018
.004
.012
11
11
0
2
1
.630 BSC
.630 BSC
.551 BSC
.551 BSC
.039 REF
.031 BSC
INCHES
D1
L
NOM
64
16
D
.039
.024
.015
3.5
12
12
A
A1
MAX
.047
.041
.006
.030
.008
.018
(F)
13
13
7
MIN
0.95
0.05
0.45
0.09
0.30
11
11
0
MILLIMETERS*
© 2006 Microchip Technology Inc.
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF
Revised 7-20-06
0.80 BSC
NOM
64
16
1.00
0.60
0.37
3.5
12
12
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13
13
7