AT91SAM9G45-CU-999 Atmel, AT91SAM9G45-CU-999 Datasheet - Page 1192

• Manufacturer Part Number: AT91SAM9G45-CU-999
• Description: IC MCU ARM9 APMC 324TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9G45-CU-999

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 400MHz
• Connectivity: EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 1.1 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Table 47-1.
Table 47-2.
Table 47-3.
Table 47-4.
47.2
1192
Ball Land
Soldering Mask Opening
400
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Soldering Profile
AT91SAM9G45
Soldering Information
Device and 324-ball TFBGA Package Maximum Weight
324-ball TFBGA Package Characteristics
Package Reference
This package respects the recommendations of the NEMI User Group.
Table 47-5
Table 47-5.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C
gives the recommended soldering profile from J-STD-020C.
Soldering Profile
mg
0.4 mm +/- 0.05
0.275 mm +/- 0.03
3
MO-210
e1
Green Package
3 C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 C
6 C/sec. max.
8 min. max.
6438F–ATARM–21-Jun-10