AT91SAM9G45-CU-999 Atmel, AT91SAM9G45-CU-999 Datasheet - Page 997

IC MCU ARM9 APMC 324TFBGA

AT91SAM9G45-CU-999

Manufacturer Part Number
AT91SAM9G45-CU-999
Description
IC MCU ARM9 APMC 324TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet

Specifications of AT91SAM9G45-CU-999

Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT91SAM9G45-CU-999
Manufacturer:
Atmel
Quantity:
10 000
Figure 41-13. Multi-buffer Transfer with Source Address Auto-reloaded and Contiguous Destination Address
6438F–ATARM–21-Jun-10
Address of
Source Layer
The transfer is similar to that shown in
The DMAC Transfer flow is shown in
b. If the buffer complete interrupt is masked (DMAC_EBCIMR.BTC[x] = ‘1’, where x is
SADDR
automatic transfer mode bit should remain enabled to keep the DMAC in Row 11 as
shown in
the channel number) then hardware does not stall until it detects a write to the buf-
fer transfer completed interrupt enable register but starts the next buffer transfer
immediately. In this case software must clear the automatic mode bit,
DMAC_CTRLBx.AUTO, to put the device into ROW 1 of
before the last buffer of the DMAC transfer has completed.
Source Buffers
Table 41-2 on page
Figure 41-14 on page
Buffer0
Buffer2
Buffer1
Figure 41-13 on page
982.
Destination Buffers
DADDR(0)
DADDR(1)
DADDR(2)
Destination Layer
998.
Address of
997.
Table 41-2 on page 982
AT91SAM9G45
997

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