HD64F3067RF20 Renesas Electronics America, HD64F3067RF20 Datasheet - Page 664

IC H8 MCU FLASH 128K 100-QFP

HD64F3067RF20

Manufacturer Part Number
HD64F3067RF20
Description
IC H8 MCU FLASH 128K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3067RF20

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Package
100PQFP
Family Name
H8
Maximum Speed
20 MHz
Operating Supply Voltage
5 V
Data Bus Width
16|32 Bit
Number Of Programmable I/os
70
Interface Type
SCI
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Number Of Timers
7
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 18 ROM
Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware
standby mode.
Figure 18.13 shows the flash memory state transition diagram.
Notes: 1. This is the state in which the P or E bit in FLMCR is set to 1. In this state, NMI input is
Rev. 4.00 Jan 26, 2006 page 640 of 938
REJ09B0276-0400
2. For a detailed description of the FLER bits setting conditions, see section 18.3.4, Flash
3. Data can be written to FLMCR and EBR. However, when transition to the software
disabled. For more information, see section 18.6.4, NMI Input Disable Conditions.
Memory Status Register (FLMSR).
standby mode was made in the error protection state, the registers are initialized.

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