HD64F2134FA20 Renesas Electronics America, HD64F2134FA20 Datasheet - Page 54

• Manufacturer Part Number: HD64F2134FA20
• Description: IC H8S MCU FLASH 128K 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of HD64F2134FA20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: IrDA, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 58
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 24.3
Table 24.4
Table 24.5
Section 25 Electrical Characteristics
Table 25.1
Table 25.1
Table 25.1
Table 25.1
Table 25.2
Table 25.3
Table 25.3
Table 25.3
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.9
Table 25.10 I
Table 25.11 A/D Conversion Characteristics
Table 25.12 A/D Conversion Characteristics
Table 25.13 D/A Conversion Characteristics ............................................................................. 729
Table 25.14 Flash Memory Characteristics (Programming/Erasing Operating Range) ............. 730
Table 25.15 Absolute Maximum Ratings................................................................................... 733
Table 25.16 DC Characteristics (1) ............................................................................................ 734
Table 25.16 DC Characteristics (2) ............................................................................................ 737
Table 25.16 DC Characteristics (3) ............................................................................................ 740
Table 25.17 Permissible Output Currents .................................................................................. 743
Table 25.18 Bus Drive Characteristics ....................................................................................... 744
Table 25.19 Clock Timing ......................................................................................................... 745
Table 25.20 Control Signal Timing............................................................................................ 746
Table 25.21 Bus Timing............................................................................................................. 747
Table 25.22 Timing of On-Chip Supporting Modules (1).......................................................... 749
Table 25.22 Timing of On-Chip Supporting Modules (2).......................................................... 751
Table 25.23 I
Table 25.24 A/D Conversion Characteristics
Rev. 4.00 Jun 06, 2006 page lii of liv
Power-Down State Registers.................................................................................. 685
MSTP Bits and Corresponding On-Chip Supporting Modules .............................. 694
Oscillation Settling Time Settings.......................................................................... 696
Power Supply Voltage and Operating Range (1) (F-ZTAT Products) ................... 703
Power Supply Voltage and Operating Range (2) (F-ZTAT A-Mask Products) ..... 704
Power Supply Voltage and Operating Range (3) (Mask-ROM Products).............. 704
Power Supply Voltage and Operating Range (4) (Mask-ROM Products).............. 705
Absolute Maximum Ratings................................................................................... 706
DC Characteristics (1) ............................................................................................ 707
DC Characteristics (2) ............................................................................................ 710
DC Characteristics (3) ............................................................................................ 713
Permissible Output Currents .................................................................................. 716
Bus Drive Characteristics ....................................................................................... 718
Clock Timing ......................................................................................................... 719
Control Signal Timing............................................................................................ 720
Bus Timing............................................................................................................. 721
Timing of On-Chip Supporting Modules (1).......................................................... 723
Timing of On-Chip Supporting Modules (2).......................................................... 725
(AN7 to AN0 Input: 134/266-State Conversion) ................................................... 727
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 728
(AN7 to AN0 Input: 134/266-State Conversion) ................................................... 753
2
2
C Bus Timing....................................................................................................... 726
C Bus Timing....................................................................................................... 752