PCA9665D,112 NXP Semiconductors, PCA9665D,112 Datasheet - Page 86

• Manufacturer Part Number: PCA9665D,112
• Description: IC CNTRLR PARALLEL/I2C 20-SOIC
• Manufacturer: NXP Semiconductors

Specifications of PCA9665D,112

• Controller Type: I²C Bus Controller
• Interface: I²C
• Voltage - Supply: 2.3 V ~ 3.6 V
• Current - Supply: 100µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935279242112; PCA9665D; PCA9665D

NXP Semiconductors
18. Soldering of through-hole mount packages
PCA9665_3
Product data sheet
18.1 Introduction to soldering through-hole mount packages
18.2 Soldering by dipping or by solder wave
18.3 Manual soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Fig 50. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 03 — 12 August 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Fm+ parallel bus to I
temperature
peak
stg(max)
PCA9665
© NXP B.V. 2008. All rights reserved.
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C-bus controller
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