PCA9506DGG,512 NXP Semiconductors, PCA9506DGG,512 Datasheet - Page 29

• Manufacturer Part Number: PCA9506DGG,512
• Description: IC I/O EXPANDER I2C 40B 56TSSOP
• Manufacturer: NXP Semiconductors

Specifications of PCA9506DGG,512

• Package / Case: 56-TSSOP
• Interface: I²C
• Number Of I /o: 40
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: PCA9506
• Number Of Lines (input / Output): 40.0 / 40.0
• Operating Supply Voltage: 2.3 V to 5.5 V
• Power Dissipation: 500 mW
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 400 KHz
• Mounting Style: SMD/SMT
• Number Of Input Lines: 40.0
• Number Of Output Lines: 40.0
• Output Current: 50 mA
• Output Voltage: 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3354-5; 935280798512; PCA9506DGG

NXP Semiconductors
PCA9505_9506
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 12.
Table 13.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
13
22.
Rev. 4 — 3 August 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
40-bit I
)
)
Figure
2
C-bus I/O port with RESET, OE and INT
350 to 2000
260
250
245
22) than a SnPb process, thus
≥ 350
220
220
PCA9505/06
245
> 2000
260
245
© NXP B.V. 2010. All rights reserved.
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