The LPC1759 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz

LPC1759FBD80

Manufacturer Part NumberLPC1759FBD80
DescriptionThe LPC1759 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz
ManufacturerNXP Semiconductors
LPC1759FBD80 datasheet
 


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NXP Semiconductors
9. Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, T
equation:
T
=
T
J
T
amb
R
th(j-a)
P
D
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 5.
Thermal characteristics
V
= 2.4 V to 3.6 V; T
=
40
DD
amb
Symbol
Parameter
T
maximum junction
j(max)
temperature
LPC1759_58_56_54_52_51
Product data sheet
+
P
R
amb
D
th j a
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
= sum of internal and I/O power dissipation
C to +85
C unless otherwise specified;
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 29 March 2011
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
(C), can be calculated using the following
J
and V
. The I/O power dissipation of
DD
DD
Min
Typ
-
-
(1)
Max
Unit
C
125
© NXP B.V. 2011. All rights reserved.
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