LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 3

• Manufacturer Part Number: LPC11U35FHI33/501,
• Description: ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC11U35FHI33/501,

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC11U3x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 12 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-32
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 490

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC11U3X
Product data sheet
Type number
LPC11U34FHN33/311
LPC11U34FBD48/311
LPC11U34FHN33/421
LPC11U34FBD48/421
LPC11U35FHN33/401
LPC11U35FBD48/401
LPC11U35FBD64/401
LPC11U35FHI33/501
LPC11U35FET48/501
LPC11U36FBD48/401
LPC11U36FBD64/401
LPC11U37FBD48/401
LPC11U37FBD64/501
Ordering information
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Package
Name
HVQFN33
LQFP48
HVQFN33
LQFP48
HVQFN33
LQFP48
LQFP64
HVQFN33
TFBGA48
LQFP48
LQFP64
LQFP48
LQFP64
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Temperature range −40 °C to +85 °C.
Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages.
Consumer peripherals
Medical
Industrial control
Description
plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2
plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 5 × 5 × 0.85 mm
plastic thin fine-pitch ball grid array package; 48 balls;
body 4.5 × 4.5 × 0.7 mm
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 April 2012
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Handheld scanners
USB audio devices
32-bit ARM Cortex-M0 microcontroller
LPC11U3x
© NXP B.V. 2012. All rights reserved.
Version
n/a
SOT313-2
n/a
SOT313-2
n/a
SOT313-2
n/a
SOT1155-2
SOT313-2
SOT313-2
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