LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 65

• Manufacturer Part Number: LPC11U35FHI33/501,
• Description: ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC11U35FHI33/501,

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC11U3x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 12 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-32
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 490

NXP Semiconductors
LPC11U3X
Product data sheet
Fig 40. Reflow soldering for the LQFP48 package
Footprint information for reflow soldering of LQFP48 package
DIMENSIONS in mm
0.500
P1
0.560
P2
10.350
Hy
Ax
solder land
occupied area
Gy
10.350 7.350
Ay
C
Bx
7.350
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
0.280
Rev. 1 — 20 April 2012
Generic footprint pattern
D1
P1
0.500
D2
Hx
Gx
Bx
Ax
7.500
Gx
7.500 10.650 10.650
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
Hy
By
LPC11U3x
© NXP B.V. 2012. All rights reserved.
Ay
sot313-2_fr
SOT313-2
65 of 70