LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 59

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LPC11U35FHI33/501,

Manufacturer Part Number
LPC11U35FHI33/501,
Description
ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC11U35FHI33/501,

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11U3x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
64 KB
Data Ram Size
12 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
HVQFN-32
Mounting Style
SMD/SMT
Factory Pack Quantity
490
NXP Semiconductors
Fig 34. Package outline TFBGA48 (SOT1155-2)
LPC11U3X
Product data sheet
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm
Dimensions
mm
SOT1155-2
Unit
Outline
version
max
nom
min
1.10
0.95
0.85
ball A1
index area
ball A1
index area
A
0.30
0.25
0.20
A
1
G
H
E
D
C
B
F
A
0.80
0.70
0.65
A
IEC
2
1
0.35
0.30
0.25
e
b
2
4.6
4.5
4.4
3
D
4
4.6
4.5
4.4
e
JEDEC
D
E
1
All information provided in this document is subject to legal disclaimers.
- - -
5
0
1/2 e
0.5
e
6
References
b
7
3.5
e
Rev. 1 — 20 April 2012
1
8
3.5
e
2
JEITA
1/2 e
0.15
scale
B
e
v
Ø v
Ø w
e
0.05
E
A
2
w
C
C
0.08
A
y
B
0.1
A
y
1
32-bit ARM Cortex-M0 microcontroller
A
5 mm
2
y
1
A
1
C
detail X
European
projection
LPC11U3x
C
X
y
© NXP B.V. 2012. All rights reserved.
Issue date
11-01-18
11-03-01
sot1155-2_po
SOT1155-2
59 of 70

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