LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 57

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LPC11U35FHI33/501,

Manufacturer Part Number
LPC11U35FHI33/501,
Description
ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC11U35FHI33/501,

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11U3x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
64 KB
Data Ram Size
12 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
HVQFN-32
Mounting Style
SMD/SMT
Factory Pack Quantity
490
NXP Semiconductors
12. Package outline
Fig 32. Package outline HVQFN33 (5 x 5 x 0.85 mm)
LPC11U3X
Product data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
(1)
max
nom
min
terminal 1
index area
terminal 1
index area
0.85
A
L
(1)
E h
0.05
0.00
8
1
A
1
32
0.30
0.18
9
b
IEC
e
0.2
c
D
5.1
4.9
(1)
e 1
D h
D
3.75
3.45
1/2 e
D
MO-220
JEDEC
h
All information provided in this document is subject to legal disclaimers.
E
5.1
4.9
b
(1)
0
References
3.75
3.45
E
25
16
Rev. 1 — 20 April 2012
h
0.5
17
24
e
JEITA
B
1/2 e
e
scale
3.5
e
w
2.5
v
A
E
1
e 2
3.5
e
C
C
2
A
0.5
0.3
B
L
0.1
v
5 mm
A
32-bit ARM Cortex-M0 microcontroller
0.05
w
y 1 C
A 1
0.05
y
European
projection
0.1
detail X
y
1
X
C
LPC11U3x
y
© NXP B.V. 2012. All rights reserved.
Issue date
11-10-11
11-10-17
c
hvqfn33f_po
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