ST72F324BJ6T6 STMicroelectronics, ST72F324BJ6T6 Datasheet - Page 178

• Manufacturer Part Number: ST72F324BJ6T6
• Description: IC MCU 8BIT 32K FLASH 44-LQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F324BJ6T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• For Use With: 497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5590

Package characteristics
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13.4
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Thermal characteristics
Table 115. Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Ecopack information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in
Figure 89. pin 1 orientation in tape and reel conditioning
See also
and
of an application can be defined by the user with the formula: P
internal power (I
application.
Symbol
Figure 91: ST72P324Bxx-Auto FastROM commercial product structure on page
T
R
Jmax
P
thJA
D
Figure 90: ST72F324Bxx-Auto Flash commercial product structure on page 182
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
Pin 1
Package thermal resistance (junction to ambient):
LQFP44 10x10
LQFP32 7x7
Power dissipation
Maximum junction temperature
DD
x V
Left orientation
DD
) and P
PORT
Doc ID13466 Rev 4
(1)
is the port power dissipation depending on the ports used in the
Ratings
Figure
(2)
89.
Right orientation (EIA 481-C compliant)
D
D
= P
= (T
INT
J
-T
+ P
A
) / R
PORT
thJA
where P
. The power dissipation
Pin 1
Value
500
150
52
70
ST72324B-Auto
INT
is the chip
°C/W
184.
Unit
mW
°C
®