AT91SAM9260B-CU-999 Atmel, AT91SAM9260B-CU-999 Datasheet - Page 211
![IC MCU ARM9 217LFBGA](/photos/12/13/121366/217-lfbga_sml.jpg)
AT91SAM9260B-CU-999
Manufacturer Part Number
AT91SAM9260B-CU-999
Description
IC MCU ARM9 217LFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet
1.AT91SAM9260B-CU-999.pdf
(798 pages)
Specifications of AT91SAM9260B-CU-999
Core Processor
ARM9
Core Size
16/32-Bit
Speed
180MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
POR, WDT
Number Of I /o
96
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
217-LFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
2-Wire, EBI, I2S, SPI, USART
Maximum Clock Frequency
180 MHz
Number Of Programmable I/os
96
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9260-EK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
For Use With
AT91SAM9260-EK - KIT EVAL FOR AT91SAM9260AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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- Download datasheet (12Mb)
Figure 21-5. Refresh Cycle Followed by a Read Access
21.5.5
21.5.5.1
6221I–ATARM–17-Jul-09
SDRAMC_A[12:0]
D[31:0]
SDWE
(input)
SDCS
SDCK
RAS
CAS
Power Management
Row n
Self-refresh Mode
col c col d
Dnb
Dnc
Three low-power modes are available:
The SDRAM Controller activates one low-power mode as soon as the SDRAM device is not
selected. It is possible to delay the entry in self-refresh and power-down mode after the last
access by programming a timeout value in the Low Power Register.
This mode is selected by programming the LPCB field to 1 in the SDRAMC Low Power Register.
In self-refresh mode, the SDRAM device retains data without external clocking and provides its
own internal clocking, thus performing its own auto-refresh cycles. All the inputs to the SDRAM
device become “don’t care” except SDCKE, which remains low. As soon as the SDRAM device
is selected, the SDRAM Controller provides a sequence of commands and exits self-refresh
mode.
Some low-power SDRAMs (e.g., mobile SDRAM) can refresh only one quarter or a half quarter
or all banks of the SDRAM array. This feature reduces the self-refresh current. To configure this
feature, Temperature Compensated Self Refresh (TCSR), Partial Array Self Refresh (PASR)
and Drive Strength (DS) parameters must be set in the Low Power Register and transmitted to
the low-power SDRAM during initialization.
Dnd
• Self-refresh Mode: The SDRAM executes its own Auto-refresh cycle without control of the
• Power-down Mode: Auto-refresh cycles are controlled by the SDRAM Controller. Between
• Deep Power-down Mode: (Only available with Mobile SDRAM) The SDRAM contents are
SDRAM Controller. Current drained by the SDRAM is very low.
auto-refresh cycles, the SDRAM is in power-down. Current drained in Power-down mode is
higher than in Self-refresh Mode.
lost, but the SDRAM does not drain any current.
t
RP
= 3
t
RC
= 8
Row m
AT91SAM9260
t
RCD
= 3
col a
CAS = 2
Dma
211
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