P89LPC972FDH,129 NXP Semiconductors, P89LPC972FDH,129 Datasheet - Page 45

• Manufacturer Part Number: P89LPC972FDH,129
• Description: MCU 80C51 8KB FLASH 20TSSOP
• Manufacturer: NXP Semiconductors
• Series: LPC900r

Specifications of P89LPC972FDH,129

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 20-TSSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 18
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: P89LPC
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 18 MHz
• Number Of Programmable I/os: 15
• Number Of Timers: 5
• Operating Supply Voltage: 2.4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935290299129

NXP Semiconductors
8. Limiting values
Table 10.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
P89LPC97X
Product data sheet
Symbol
T
T
I
I
I
V
V
P
V
OH(I/O)
OL(I/O)
I/Otot(max)
amb(bias)
stg
xtal
n
tot(pack)
ESD
The following applies to
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over ambient temperature range unless otherwise specified. All voltages are with respect to V
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
bias ambient temperature
storage temperature
HIGH-level output current per
input/output pin
LOW-level output current per
input/output pin
maximum total input/output current
crystal voltage
voltage on any other pin
total power dissipation (per package)
electrostatic discharge voltage
Table
10:
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 June 2010
Conditions
on XTAL1, XTAL2 pins when
XTAL1/XTAL2 is used as
crystal input/output; with
respect to V
on XTAL1, XTAL2 pins when
XTAL1/XTAL2 is used as
GPIO; with respect to V
with respect to V
based on package heat
transfer, not device power
consumption
human body model; all pins
charged device model; all
pins
8-bit microcontroller with accelerated two-clock 80C51 core
SS
SS
[1]
SS
P89LPC970/971/972
[2]
Min
−55
−65
-
-
-
−0.5
−0.5
-
-
−3000
−700
Max
+125
+150
20
20
100
+4.0
+5.5
5.5
1.5
+3000
+700
© NXP B.V. 2010. All rights reserved.
SS
unless
Unit
°C
°C
mA
mA
mA
V
V
V
W
V
V
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