LPC2939FBD208,551 NXP Semiconductors, LPC2939FBD208,551 Datasheet - Page 3

• Manufacturer Part Number: LPC2939FBD208,551
• Description: IC ARM9 MCU FLASH 768KB 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2939FBD208,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 152
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11027
• Package: 208LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 160
• Interface Type: CAN/I2C/LIN/QSPI/UART/USB
• On-chip Adc: 24-chx10-bit
• Number Of Timers: 6
• For Use With: 568-4787 - BOARD EVAL LPC2939
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287113551

NXP Semiconductors
3. Ordering information
Table 1.
Table 2.
LPC2939_3
Product data sheet
Type number
LPC2939FBD208
Type number
LPC2939FBD208
Ordering information
Part options
3.1 Ordering options
Package
Name
LQFP208 plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm

Flash
memory
768 kB
40 C to +85 C ambient operating temperature range
Description
SRAM
56 kB +
2  32 kB TCM
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 7 April 2010
SMC
32-bit
USB
Host/
OTG/
device
yes
ARM9 microcontroller with CAN, LIN, and USB
UART
RS-485/
modem
2
LIN 2.0/
UART
2
CAN
2
LPC2939
© NXP B.V. 2010. All rights reserved.
Package
LQFP208
Version
SOT459-1
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