LPC2939FBD208,551 NXP Semiconductors, LPC2939FBD208,551 Datasheet - Page 77

• Manufacturer Part Number: LPC2939FBD208,551
• Description: IC ARM9 MCU FLASH 768KB 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2939FBD208,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 152
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11027
• Package: 208LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 160
• Interface Type: CAN/I2C/LIN/QSPI/UART/USB
• On-chip Adc: 24-chx10-bit
• Number Of Timers: 6
• For Use With: 568-4787 - BOARD EVAL LPC2939
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287113551

NXP Semiconductors
Table 38.
V
ground; positive currents flow into the IC; unless otherwise specified.
[1]
[2]
[3]
Table 39.
V
T
specified.
[1]
LPC2939_3
Product data sheet
Symbol
t
Symbol
f
t
f(o)
SPI
su(SPI_MISO)
vj
DD(CORE)
DD(CORE)
=
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
Bus capacitance C
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.

40

[1]
C to +85
= V
= V
Dynamic characteristic: I
Dynamic characteristics of SPI pins
DD(OSC_PLL)
DD(OSC_PLL)
Parameter
SPI operating frequency
SPI_MISO set-up time
9.3 Dynamic characteristics: I
9.4 Dynamic characteristics: SPI
Parameter
output fall time

C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
b
from 10 pF to 400 pF.
; V
; V
Fig 27. SPI data input set-up time in SSP Master mode
DD(IO)
DD(IO)
SDOn
SCKn
shifting edges
SDIn
= 2.7 V to 3.6 V; V
= 2.7 V to 3.6 V; V
2
C-bus pins
All information provided in this document is subject to legal disclaimers.
Conditions
master operation
slave operation
T
measured in SPI
Master mode;
see
Rev. 03 — 7 April 2010
DDA(ADC3V3)
DDA(ADC3V3)
amb
Figure 27
Conditions
V
= 25 C;
amb
amb
IH
to V
= 25 C (final testing). Both pre-testing and final testing use correlated
= 25 C (final testing). Both pre-testing and final testing use correlated
2
C-bus interface
= 3.0 V to 3.6 V; all voltages are measured with respect to
IL
= 3.0 V to 3.6 V; V
t
su(SPI_MISO)
[1]
ARM9 microcontroller with CAN, LIN, and USB
Min
20 + 0.1  C
Min
1
1
-


65024
65024
DDA(ADC5V0)
f
f
clk(SPI)
clk(SPI)
b
[3]
Typ
-
-
11
Typ
-
= 3.0 V to 5.5 V;
[2]
sampling edges
LPC2939
© NXP B.V. 2010. All rights reserved.
Max
1
1
-


2
4
amb
amb
Max
-
f
f
clk(SPI)
clk(SPI)
= 85 C ambient
= 85 C ambient
002aae695
Unit
MHz
MHz
ns
77 of 99
Unit
ns