MC56F8014VFAE Freescale Semiconductor, MC56F8014VFAE Datasheet - Page 119

• Manufacturer Part Number: MC56F8014VFAE
• Description: IC DIGITAL SIGNAL CTRLR 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8014VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 2K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 32MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 26
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 2(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 26
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Rom Size: 16 KB
• Development Tools By Supplier: MC56F8037EVM, DEMO56F8014-EE, DEMO56F8013-EE
• Minimum Operating Temperature: - 40 C
• For Use With: DEMO56F8014-E - BOARD DEMO MC56F8014 W/UNIV PSDEMO56F8014 - BOARD DEMO MC56F8014 W/US PSAPMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEMDEMO56F8014-EE - BOARD DEMO FOR 56F8014
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Freescale Semiconductor
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
Figure 11-2 56F8014 32-Pin LQFP Mechanical Information
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
X
–Z–
25
K
R
4X
56F8014 Technical Data, Rev. 11
17
4X
Q
0.20 (0.008)
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É É É
É É
É É
T–U
METAL
BASE
Z
J
N
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
56F8014 Package and Pin-Out Information
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
DETAIL Y
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
1
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
AE
AE
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
5
119