MC56F8014VFAE Freescale Semiconductor, MC56F8014VFAE Datasheet - Page 5

• Manufacturer Part Number: MC56F8014VFAE
• Description: IC DIGITAL SIGNAL CTRLR 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8014VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 2K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 32MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 26
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 2(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 26
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Rom Size: 16 KB
• Development Tools By Supplier: MC56F8037EVM, DEMO56F8014-EE, DEMO56F8013-EE
• Minimum Operating Temperature: - 40 C
• For Use With: DEMO56F8014-E - BOARD DEMO MC56F8014 W/UNIV PSDEMO56F8014 - BOARD DEMO MC56F8014 W/US PSAPMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEMDEMO56F8014-EE - BOARD DEMO FOR 56F8014
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . . 6
Part 2: Signal/Connection Descriptions . . . 14
Part 3: OCCS . . . . . . . . . . . . . . . . . . . . . . . . . 26
Part 4: Memory Map . . . . . . . . . . . . . . . . . . . 29
Part 5: Interrupt Controller (ITCN) . . . . . . . . 43
Part 6: System Integration Module (SIM) . . 62
Freescale Semiconductor
1.1. 56F8014 Features . . . . . . . . . . . . . . . . . . . . 6
1.2. 56F8014 Description. . . . . . . . . . . . . . . . . . . 8
1.3. Award-Winning Development Environment . 8
1.4. Architecture Block Diagram . . . . . . . . . . . . . 9
1.5. Synchronize ADC with PWM . . . . . . . . . . . . 9
1.6. Multiple Frequency PWM Output . . . . . . . . . 9
1.7. Product Documentation . . . . . . . . . . . . . . . 13
1.8. Data Sheet Conventions. . . . . . . . . . . . . . . 13
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2. 56F8014 Signal Pins . . . . . . . . . . . . . . . . . 18
3.1. Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.3. Operating Modes . . . . . . . . . . . . . . . . . . . . 26
3.4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . 28
3.5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . 29
4.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2. Interrupt Vector Table . . . . . . . . . . . . . . . . . 29
4.3. Program Map . . . . . . . . . . . . . . . . . . . . . . . 31
4.4. Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.5. EOnCE Memory Map . . . . . . . . . . . . . . . . . 32
4.6. Peripheral Memory Mapped Registers . . . . 33
5.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 43
5.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
5.3. Functional Description . . . . . . . . . . . . . . . . 43
5.4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . 45
5.5. Register Descriptions . . . . . . . . . . . . . . . . . 45
5.6. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 62
6.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
6.3. Register Descriptions . . . . . . . . . . . . . . . . . 64
6.4. Clock Generation Overview . . . . . . . . . . . . 77
6.5. Power-Down Modes . . . . . . . . . . . . . . . . . . 77
6.6. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.7. Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.8. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . 82
56F8014 Data Sheet Table of Contents
56F8014 Technical Data, Rev. 11
Part 7: Security Features . . . . . . . . . . . . . . .82
Part 8: General Purpose Input/Output (GPIO)
Part 9: Joint Test Action Group (JTAG) . . .91
Part 10: Specifications . . . . . . . . . . . . . . . . .91
Part 11: Packaging . . . . . . . . . . . . . . . . . . .115
Part 12: Design Considerations . . . . . . . . .118
Part 13: Ordering Information . . . . . . . . . .121
Part 14: Appendix . . . . . . . . . . . . . . . . . . . .122
7.1. Operation with Security Enabled . . . . . . . . . 82
7.2. Flash Access Lock and Unlock Mechanisms 83
7.3. Product Analysis. . . . . . . . . . . . . . . . . . . . . . 84
8.1. Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . 84
8.2. Configuration . . . . . . . . . . . . . . . . . . . . . . . . 84
8.3. Reset Values . . . . . . . . . . . . . . . . . . . . . . . . 86
9.1. 56F8014 Information . . . . . . . . . . . . . . . . . . 91
10.1. General Characteristics . . . . . . . . . . . . . . . 91
10.2. DC Electrical Characteristics . . . . . . . . . . . 95
10.3. AC Electrical Characteristics . . . . . . . . . . . 97
10.4. Flash Memory Characteristics . . . . . . . . . . 98
10.5. External Clock Operation Timing . . . . . . . . 99
10.6. Phase Locked Loop Timing . . . . . . . . . . . . 99
10.7. Relaxation Oscillator Timing. . . . . . . . . . . 100
10.8. Reset, Stop, Wait, Mode Select, and
10.9. Serial Peripheral Interface (SPI) Timing . . 102
10.10. Quad Timer Timing. . . . . . . . . . . . . . . . . 105
10.11. Serial Communication Interface (SCI)
10.12. Inter-Integrated Circuit Interface (I2C)
10.13. JTAG Timing. . . . . . . . . . . . . . . . . . . . . . 109
10.14. Analog-to-Digital Converter (ADC)
10.15. Equivalent Circuit for ADC Inputs . . . . . . 112
10.16. Power Consumption . . . . . . . . . . . . . . . . 112
11.1. 56F8014 Package and Pin-Out
12.1. Thermal Design Considerations . . . . . . . . 118
12.2. Electrical Design Considerations . . . . . . . 119
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
Interrupt Timing . . . . . . . . . . . . . . 101
Timing . . . . . . . . . . . . . . . . . . . . . 107
Timing . . . . . . . . . . . . . . . . . . . . . 108
Parameters . . . . . . . . . . . . . . . . . 111
Information . . . . . . . . . . . . . . . . . . 115
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