MC56F8014VFAE Freescale Semiconductor, MC56F8014VFAE Datasheet - Page 93

• Manufacturer Part Number: MC56F8014VFAE
• Description: IC DIGITAL SIGNAL CTRLR 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8014VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 2K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 32MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 26
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 2(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 26
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Rom Size: 16 KB
• Development Tools By Supplier: MC56F8037EVM, DEMO56F8014-EE, DEMO56F8013-EE
• Minimum Operating Temperature: - 40 C
• For Use With: DEMO56F8014-E - BOARD DEMO MC56F8014 W/UNIV PSDEMO56F8014 - BOARD DEMO MC56F8014 W/US PSAPMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEMDEMO56F8014-EE - BOARD DEMO FOR 56F8014
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

1. Pin Group 3 can tolerate 6V for less than 5 seconds when they are configured as ADC inputs or during reset. Pin Group 3 can
2. Continuous input current per pin is -2 mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC analog inputs
10.1.1
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESC51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
Freescale Semiconductor
tolerate 6V if they are configured as GPIO.
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
measured on the top surface of the board near the package.
Junction to ambient
Natural convection
Junction to ambient
Natural convection
Junction to ambient
(@200 ft/min)
Junction to ambient
(@200 ft/min)
Junction to board
Junction to case
Junction to package top
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
ElectroStatic Discharge (ESD) Model
Characteristic
Table 10-3 LQFP Package Thermal Characteristics
Characteristic
Table 10-2 56F8014 ESD Protection
Single layer board
(1s)
Four layer board
(2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
Comments
56F8014 Technical Data, Rev. 11
2000
Min
200
750
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJMA
θJC
θJA
θJB
JT
Typ
—
—
—
(LQFP)
Value
74
50
67
46
23
20
4
Max
—
—
—
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
General Characteristics
V
V
V
Notes
1,2
1,3
1,3
1,3
4
5
6
93