MC9S12DT256MPVE Freescale Semiconductor, MC9S12DT256MPVE Datasheet - Page 670

IC MCU 256K FLASH 25MHZ 112-LQFP

MC9S12DT256MPVE

Manufacturer Part Number
MC9S12DT256MPVE
Description
IC MCU 256K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12DT256MPVE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
S12D
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
91
Number Of Timers
1
Operating Supply Voltage
5 V to 2.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68KIT912DP256
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
12KB
Cpu Speed
25MHz
No. Of Timers
1
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 18 Memory Mapping Control (S12XMMCV3)
18.3.2.12 RAM Shared Region Upper Boundary Register (RAMSHU)
Read: Anytime
Write: Anytime when RWPE = 0
670
Address: 0x011F
SHU[6:0]
Reset
Field
6–0
W
R
RAM Shared Region Upper Boundary Bits 6–0 — These bits define the upper boundary of the shared
memory in multiples of 256 bytes. The block selected by this register is included in the region. See
for details.
1
1
7
Figure 18-20. RAM Shared Region Upper Boundary Register (RAMSHU)
= Unimplemented or Reserved
SHU6
1
6
Table 18-18. RAMSHU Field Descriptions
MC9S12XDP512 Data Sheet, Rev. 2.21
SHU5
1
5
SHU4
1
4
Description
SHU3
1
3
SHU2
1
2
Freescale Semiconductor
SHU1
1
1
Figure 18-25
SHU0
1
0

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