UPD78F1001GB-GAF-AX Renesas Electronics America, UPD78F1001GB-GAF-AX Datasheet - Page 3
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UPD78F1001GB-GAF-AX
Manufacturer Part Number
UPD78F1001GB-GAF-AX
Description
MCU 16BIT 78K0R/KX3-L 44-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Kx3-Lr
Datasheet
1.UPD78F1000GB-GAF-AX.pdf
(1171 pages)
Specifications of UPD78F1001GB-GAF-AX
Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD78F1001GB-GAF-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN:
(2) HANDLING OF UNUSED INPUT PINS:
(3) PRECAUTION AGAINST ESD:
(4) STATUS BEFORE INITIALIZATION:
(5) POWER ON/OFF SEQUENCE:
(6) INPUT OF SIGNAL DURING POWER OFF STATE :
reflected wave may cause malfunction.
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction.
from entering the device when the input level is fixed, and also in the transition period when the input level
passes through the area between VIL (MAX) and VIH (MIN).
If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction.
CMOS devices must be fixed high or low by using pull-up or pull-down circuitry.
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin.
related to unused pins must be judged separately for each device and according to related specifications
governing the device.
destruction of the gate oxide and ultimately degrade the device operation.
generation of static electricity as much as possible, and quickly dissipate it when it has occurred.
Environmental control must be adequate.
to avoid using insulators that easily build up static electricity.
transported in an anti-static container, static shielding bag or conductive material.
tools including work benches and floors should be grounded.
wrist strap.
taken for PW boards with mounted semiconductor devices.
device.
initialized.
device is not initialized until the reset signal is received.
after power-on for devices with reset functions.
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply.
the internal power supply.
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current.
for each device and according to related specifications governing the device.
while the device is not powered.
power supply may cause malfunction and the abnormal current that passes in the device at this time may
cause degradation of internal elements.
separately for each device and according to related specifications governing the device.
Immediately after the power source is turned ON, devices with reset functions have not yet been
Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers.
Semiconductor devices must not be touched with bare hands.
When switching the power supply off, as a rule, switch off the external power supply and then
CMOS devices behave differently than Bipolar or NMOS devices.
Use of the reverse power on/off sequences may result in the application of an
In the case of a device that uses different power supplies for the internal
The current injection that results from input of such a signal or I/O pull-up
A strong electric field, when exposed to a MOS device, can cause
NOTES FOR CMOS DEVICES
Power-on does not necessarily define the initial status of a MOS
If the input of the CMOS device stays in the area between VIL
Unconnected CMOS device inputs can be cause of malfunction.
When it is dry, a humidifier should be used.
Input of signals during the power off state must be judged
The correct power on/off sequence must be judged separately
Do not input signals or an I/O pull-up power supply
A reset operation must be executed immediately
Waveform distortion due to input noise or a
Semiconductor devices must be stored and
The operator should be grounded using a
Take care to prevent chattering noise
Similar precautions need to be
Steps must be taken to stop
Each unused pin should be
All test and measurement
It is recommended
Input levels of
All handling
A
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