EP3C16F256I7 Altera, EP3C16F256I7 Datasheet - Page 401

• Manufacturer Part Number: EP3C16F256I7
• Description: Cyclone III
• Manufacturer: Altera

Introduction
Altera Corporation
March 2007
CIII51015-1.0
This chapter provides package information for Altera
devices, including:
■
■
■
Table 15–1
Table 15–1. Cyclone III Device Package Options (Part 1 of 2)
EP3C10
EP3C16
EP3C25
EP3C40
Device
EP3C5
Device and package cross-reference
Thermal resistance values
Package outlines
shows Cyclone III device package options.
Plastic Enhanced Quad Flat Pack (EQFP) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
Plastic Enhanced Quad Flat Pack (EQFP) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
Plastic Enhanced Quad Flat Pack (EQFP) – Wire Bond
Plastic Quad Flat Pack (PQFP) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 3 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
Plastic Enhanced Quad Flat Pack (EQFP) – Wire Bond
Plastic Quad Flat Pack (PQFP) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Wire Bond
Plastic Quad Flat Pack (PQFP) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 3 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
15. Package Information for
Package
Cyclone III Devices
(2)
®
Cyclone
Preliminary
®
III
144
144
144
144
Pins
256
256
256
256
240
256
256
484
484
240
256
256
324
240
324
484
484
780
15–1
(1)
(1)
(1)
(1)