PNX1702EH/G,557 NXP Semiconductors, PNX1702EH/G,557 Datasheet - Page 72
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
PNX1702EH/G,557
Manufacturer Part Number
PNX1702EH/G,557
Description
IC MEDIA PROC 500MHZ 456-BGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1702EHG557.pdf
(832 pages)
Specifications of PNX1702EH/G,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Ram Size
208K x 8
Interface
I²C, 2-Wire Serial
Number Of I /o
61
Voltage - Supply
1.33 V ~ 1.47 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
456-HBGA
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Lead Free Status / Rohs Status
Compliant
Other names
935281647557
PNX1702EH/G
PNX1702EH/G
PNX1702EH/G
PNX1702EH/G
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Philips Semiconductors
Volume 1 of 1
8. Package Outline
PNX17XX_SER_1
Preliminary data sheet
Figure 24: BGA456 Plastic Ball grid Array; 456 Balls; body 27 x 27 x 1.75 mm
BGA456: plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
SOT795-1
OUTLINE
max.
2.45
Latest information may be found at http://www.semiconductors.philips.com/package/SOT900-1.html
A
ball A1
index area
shape
optional (4x)
AD
AB
AF
0.6
0.4
A 1
M
Y
V
P
K
H
D
B
T
F
AE
AC
AA
W
U
R
N
G
C
A
L
E
J
1.85
1.60
A 2
1
2
3
144E
4
IEC
e
0.7
0.5
5
b
6
7
8 10 12 14 16 18 20 22 24 26
27.2
26.8
9
D
11 13 15 17 19 21 23 25
24.75
23.75
D 1
e 1
D
D 1
MS-034
JEDEC
1/2
27.2
26.8
e
E
0
REFERENCES
24.75
23.75
Rev. 1 — 17 March 2006
E 1
b
1
e
JEITA
scale
- - -
10
1/2
E 1
B
e
e 1
25
e
w
v
A
E
e 2
M
M
e 2
25
C
C
A
20 mm
0.3
B
v
A
0.15
A 2
w
A
1
y 1 C
Chapter 1: Integrated Circuit Data
0.2
y
PROJECTION
EUROPEAN
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
0.35
y 1
detail X
PNX17xx Series
C
X
y
ISSUE DATE
02-11-18
SOT795-1
1-45
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