PNX1702EH/G,557 NXP Semiconductors, PNX1702EH/G,557 Datasheet - Page 79
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PNX1702EH/G,557
Manufacturer Part Number
PNX1702EH/G,557
Description
IC MEDIA PROC 500MHZ 456-BGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1702EHG557.pdf
(832 pages)
Specifications of PNX1702EH/G,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Ram Size
208K x 8
Interface
I²C, 2-Wire Serial
Number Of I /o
61
Voltage - Supply
1.33 V ~ 1.47 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
456-HBGA
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Lead Free Status / Rohs Status
Compliant
Other names
935281647557
PNX1702EH/G
PNX1702EH/G
PNX1702EH/G
PNX1702EH/G
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Philips Semiconductors
Volume 1 of 1
11. Miscellaneous
12. Soft Errors Due to Radiation
PNX17XX_SER_1
Preliminary data sheet
10.4 Package Handling, Soldering and Thermal Properties
should be capable to sink up to 3 A. Other VTT termination connecttions can used
like advertised by DDR manufacturers. For example placing the VTT power island at
the end of the bus, i.e. after the DDR devices, is usually easier for the board designer.
Termination resistors should be as close as possible to the VTT generator. Similar
decoupling as for the VCCM power plane is required.
MM_CKE must not be parallel terminated since it requires a 0V level at initialization
time.
Similarly for signal integrity purpose, it is possible to only series terminate the
address, the command lines, and the data lines (at the PNX1700 side). There is no
need for series termination if the parallel termination was chosen.
Up to date information can be found at
http://www.philipslogic.com/packaging/handbook
In order to limit clock jitter on the TM5250 and DDR clocks, it is recommended to
shutdown the clocks of the unused modules, typically by programming these modules
to enter the powerdown mode and switch the others to their functional clocks (i.e.
switch the module’s clocks to a frequency higher than the default 27 MHz crystal
clock when possible).
Soft errors can be caused by radiation, electromagnetic interference, or electrical
noise. This section reports the soft error rate (SER) caused by the radiation
component.
There are three primary radiation sources namely alpha particles, high-energy
cosmic rays, and neutron-induced boron fission. Alpha particles originate from
radioactive impurities in chip and package materials. Cosmic rays indirectly generate
charges by colliding with nuclei within the chip. The boron fission occurs when a low-
energy (thermal) neutron hits a 10B nucleus, which then breaks up into an alpha and
lithium recoil. The SER generated by these radiation sources is of 9900 Failure-In-
Time (FIT) which is equivalent to one failure every 10 years.
In the PNX1700, the SER is statistically improved since some of the memory
elements (that are affected by the radiation) may contain pixel data rather than control
data which further extends the SER.
Rev. 1 — 17 March 2006
Chapter 1: Integrated Circuit Data
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PNX17xx Series
1-52
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