DSP56301PW80B1 Freescale Semiconductor, DSP56301PW80B1 Datasheet - Page 101

• Manufacturer Part Number: DSP56301PW80B1
• Manufacturer: Freescale Semiconductor

Specifications of DSP56301PW80B1

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 80MHz
• Mips: 80
• Device Input Clock Speed: 80MHz
• Ram Size: 24KB
• Program Memory Size: Not RequiredKB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

3.4 MAP-BGA Package Mechanical Drawing
Freescale Semiconductor
Figure 3-6.
DSP56301 Mechanical Information, 252-pin MAP-BGA Package
DSP56301 Technical Data, Rev. 10
Notes:
1. Dimensions are in millimeters.
2. Interpret dimensions and
3. Dimension b is measured at the
4. Datum Z (seating plane) is
5. Parallelism measurement shall
tolerances per ASME Y14.5M,
1994.
maximum solder ball diameter,
parallel to datum plane Z.
defined by the spherical crowns
of the solder balls.
exclude any effect of mark on
top surface of package.
MAP-BGA Package Mechanical Drawing
DIM MIN
A1 0.50
A2
A
D
E
b
e
Millimeters
0.60
21.00 BSC
21.00 BSC
1.6
1.27 BSC
1.16 REF
MAX
0.70
0.90
1.9
3-23