DSP56301PW80B1 Freescale Semiconductor, DSP56301PW80B1 Datasheet - Page 42

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DSP56301PW80B1

Manufacturer Part Number
DSP56301PW80B1
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of DSP56301PW80B1

Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
80MHz
Mips
80
Device Input Clock Speed
80MHz
Ram Size
24KB
Program Memory Size
Not RequiredKB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
Specifications
2.5.5.2 DRAM Timing
The selection guides in Figure 2-14 and Figure 2-17 are for primary selection only. Final selection should be based
on the timing in the following tables. For example, the selection guide suggests that four wait states must be used
for 100 MHz operation in Page Mode DRAM. However, using the information in the appropriate table, a designer
could choose to evaluate whether fewer wait states might be used by determining which timing prevents operation
at 100 MHz, by running the chip at a slightly lower frequency (for example, 95 MHz), by using faster DRAM (if it
becomes available), and by manipulating control factors such as capacitive and resistive load to improve overall
system performance.
2-16
DRAM type
(t
RAC
100
80
70
60
50
ns)
Figure 2-14.
1 Wait state
2 Wait states
40
DRAM Page Mode Wait States Selection Guide
DSP56301 Technical Data, Rev. 10
Note:
66
This figure should be used for primary selection. For exact
and detailed timings see the following tables.
80
100
3 Wait states
4 Wait states
120
Chip frequency
(MHz)
Freescale Semiconductor

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