MSC8101DS Motorola / Freescale Semiconductor, MSC8101DS Datasheet - Page 111
MSC8101DS
Manufacturer Part Number
MSC8101DS
Description
MSC8101 Network Digital Signal Processor
Manufacturer
Motorola / Freescale Semiconductor
Datasheet
1.MSC8101DS.pdf
(116 pages)
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Chapter 4
Design Considerations
4.1
The average chip-junction temperature
where
The user should set T
too high, the user should either lower the ambient temperature or the power dissipation of the chip.
4.2
Not yet implemented.
Thermal Design Considerations
Electrical Design Considerations
T
P
P
P
D
INT
I/O
A
Equation 1: T
JA
= P
= ambient temperature C
= package thermal resistance
= power dissipation on output pins in W—user determined
= I
INT
DD
+ P
A
V
I/O
DD
and P
in W
J
in W—chip internal power
= T
D
A
such that T
+ (P
D
,
•
T
J ,
,
MSC8101 Technical Data
junction to ambient
J
in C can be obtained from the following:
JA
does not exceed the maximum operating conditions. In case T
)
,
C/W
J
is
4-1
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