MSC8101DS Motorola / Freescale Semiconductor, MSC8101DS Datasheet - Page 57

• Manufacturer Part Number: MSC8101DS
• Description: MSC8101 Network Digital Signal Processor
• Manufacturer: Motorola / Freescale Semiconductor

2.3
Table 2-3 describes thermal characteristics of the MSC8101.
Section 4.1, Thermal Design Considerations, on page 4-1 provides a more detailed explanation of these
characteristics.
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case (top)
Junction-to-package (top)
Notes:
Thermal Characteristics
1.
2.
3.
4.
5.
6.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer (1s) board horizontal.
Per JESD51-6 with the boards horizontal.
Thermal resistance between the die and the printed circuit board per JESD 51-8.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold
plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature, per EIA/JESD51-2.
Characteristic
1, 2
5
6
4
1, 3
Table 2-3. Thermal Characteristics
MSC8101 Technical Data
R
R
R
R
Symbol
JC
JA
JA
JB
or
or
or
or
JT
JA
JA
JB
JC
17
FC-PBGA
0.3
0.3
52
25
22
17mm
0
0
0
0
0
Unit
C/W
C/W
C/W
C/W
C/W
2-3