UPD78F0138 NEC, UPD78F0138 Datasheet - Page 525

• Manufacturer Part Number: UPD78F0138
• Description: (UPD78xxxx) 8-Bit Single-Chip Microcontrollers
• Manufacturer: NEC

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
(3) Mask ROM version (GK-9ET type)
64-pin plastic TQFP (12 × 12)
µ PD780131GK-
µ
µ
µ PD780134GK(A)-
µ
µ
µ
µ PD780134GK(A2)-
PD780134GK-
PD780131GK(A)-
PD780131GK(A1)-
PD780134GK(A1)-
PD780131GK(A2)-
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
×××
×××
Table 33-1. Surface Mounting Type Soldering Conditions (3/6)
×××
×××
-9ET, 780132GK-
-9ET, 780136GK-
×××
×××
×××
×××
-9ET, 780132GK(A)-
-9ET, 780136GK(A)-
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
-9ET, 780136GK(A2)-
-9ET, 780132GK(A1)-
-9ET, 780136GK(A1)-
-9ET, 780132GK(A2)-
Note
(after that, prebake at 125°C for 10 hours)
×××
×××
User’s Manual U16228EJ2V0UD
-9ET, 780133GK-
-9ET, 780138GK-
Soldering Conditions
×××
×××
×××
×××
×××
×××
-9ET, 780138GK(A)-
-9ET, 780133GK(A)-
-9ET, 780138GK(A2)-
-9ET, 780133GK(A1)-
-9ET, 780138GK(A1)-
-9ET, 780133GK(A2)-
Note
Note
(after that, prebake at 125°C for 10
(after that, prebake at 125°C for 10
×××
×××
-9ET,
-9ET,
×××
×××
-9ET,
-9ET,
×××
×××
×××
×××
-9ET,
-9ET,
-9ET,
-9ET
IR35-107-2
VP15-107-2
WS60-107-1
Condition Symbol
Recommended
−
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