tmp1940cyaf TOSHIBA Semiconductor CORPORATION, tmp1940cyaf Datasheet - Page 31

• Manufacturer Part Number: tmp1940cyaf
• Description: 32-bit Tx System Risc Tx19 Family
• Manufacturer: TOSHIBA Semiconductor CORPORATION

3.5.2
3.5.3
(1) Lead insertion hole intervals on the printed circuit board should match the lead pitch of the
(2) If lead insertion hole intervals on the printed circuit board do not precisely match the lead
(3) For the minimum clearance specification between a device and a
(4) Observe the following precautions when forming the leads of a device prior to mounting.
(1) When socket mounting devices on a printed circuit board, use sockets which match the
(2) Use sockets whose contacts have the appropriate contact pressure. If the contact pressure is
(3) When soldering sockets to the printed circuit board, use sockets whose construction prevents
(4) Make sure the coating agent applied to the printed circuit board for moisture-proofing
(5) If the device leads are severely bent by a socket as it is inserted or removed and you wish to
(6) If the printed circuit board with the devices mounted on it will be subjected to vibration from
The soldering temperature and heating time vary from device to device. Therefore, when
specifying the mounting conditions, refer to the individual datasheets and databooks for the
devices used.
Use a tool or jig to secure the lead at its base (where the lead meets the device package) while
bending so as to avoid mechanical stress to the device. Also avoid bending or stretching device
leads repeatedly.
Be careful not to damage the lead during lead forming.
Follow any other precautions described in the individual datasheets and databooks for each
device and package type.
device precisely.
pitch of the device, do not attempt to forcibly insert devices by pressing on them or by pulling
on their leads.
printed circuit board, refer to the relevant device’s datasheet and
databook. If necessary, achieve the required clearance by forming
the device’s leads appropriately. Do not use the spacers which are
used to raise devices above the surface of the printed circuit board
during soldering to achieve clearance. These spacers normally
continue to expand due to heat, even after the solder has begun to solidify; this applies
severe stress to the device.
Socket mounting
inserted device’s package.
insufficient, the socket may not make a perfect contact when the device is repeatedly
inserted and removed; if the pressure is excessively high, the device leads may be bent or
damaged when they are inserted into or removed from the socket.
flux from penetrating into the contacts or which allows flux to be completely cleaned off.
purposes does not stick to the socket contacts.
repair the leads so as to continue using the device, make sure that this lead correction is only
performed once. Do not use devices whose leads have been corrected more than once.
external sources, use sockets which have a strong contact pressure so as to prevent the
sockets and devices from vibrating relative to one another.
Soldering temperature profile
3 General Safety Precautions and Usage Considerations
17