tmp1940cyaf TOSHIBA Semiconductor CORPORATION, tmp1940cyaf Datasheet - Page 34

• Manufacturer Part Number: tmp1940cyaf
• Description: 32-bit Tx System Risc Tx19 Family
• Manufacturer: TOSHIBA Semiconductor CORPORATION

3.5.5
3.5.6
3.5.7
If analog devices or high-speed devices are used without being cleaned, flux residues may cause
minute amounts of leakage between pins. Similarly, dew condensation, which occurs in
environments containing residual chlorine when power to the device is on, may cause between-
lead leakage or migration. Therefore, Toshiba recommends that these devices be cleaned.
However, if the flux used contains only a small amount of halogen (0.05W% or less), the devices
may be used without cleaning without any problems.
(1) When tape carrier packages (TCPs) are mounted, measures must be taken to prevent
(2) If devices are being picked up from tape, or outer lead bonding (OLB) mounting is being
(3) The base film, which is made of polyimide, is hard and thin. Be careful not to cut or scratch
(4) When punching tape, try not to scatter broken pieces of tape too much.
(5) Treat the extra film, reels and spacers left after punching as industrial waste, taking care
(6) Chips housed in tape carrier packages (TCPs) are bare chips and therefore have their reverse
Devices delivered in chip form tend to degrade or break under external forces much more easily
than plastic-packaged devices. Therefore, caution is required when handling this type of device.
(1) Mount devices in a properly prepared environment so that chip surfaces will not be exposed
(2) When handling chips, be careful not to expose them to static electricity.
(3) Make sure that PCBs (or any other kind of circuit board) on which chips are being mounted
(4) When mounting chips on a board, use the method of assembly that is most suitable for
No cleaning
Mounting tape carrier packages (TCPs)
electrostatic breakdown of the devices.
carried out, consult the manufacturer of the insertion machine which is being used, in order
to establish the optimum mounting conditions in advance and to avoid any possible hazards.
your hands or any objects while handling the tape.
not to destroy or pollute the environment.
side exposed. To ensure that the chip will not be cracked during mounting, ensure that no
mechanical shock is applied to the reverse side of the chip. Electrical contact may also cause
a chip to fail. Therefore, when mounting devices, make sure that nothing comes into
electrical contact with the reverse side of the chip.
If your design requires connecting the reverse side of the chip to the circuit board, please
consult Toshiba or a Toshiba distributor beforehand.
Mounting chips
to polluted ambient air or other polluted substances.
In particular, measures must be taken to prevent static damage during the mounting of
chips. With this in mind, Toshiba recommend mounting all peripheral parts first and then
mounting chips last (after all other components have been mounted).
do not have any chemical residues on them (such as the chemicals which were used for
etching the PCBs).
maintaining the appropriate electrical, thermal and mechanical properties of the
semiconductor devices used.
* For details of devices in chip form, refer to the relevant device’s individual datasheets.
3 General Safety Precautions and Usage Considerations
20