ADSP-BF533 AD [Analog Devices], ADSP-BF533 Datasheet - Page 45

• Manufacturer Part Number: ADSP-BF533
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
P
the method to calculate P
Values of
circuit board design considerations.
order approximation of T
where:
T
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Thermal resistance
to performance of the package and board in a convective envi-
ronment.
conditions of airflow.
periphery of the board.
T
son and printed circuit board design considerations.
Table 33. Thermal Characteristics for BC-160 Package
Table 34. Thermal Characteristics for ST-176-1 Package
Parameter
Parameter
D
J
CASE
A
J
JT
JA
JMA
JMA
JB
JC
JA
JMA
JMA
= Junction temperature ( C)
and T
JT
JT
JT
JT
Table
= Power dissipation (see
= Ambient temperature ( C)
= From
= Case temperature ( C) measured by customer at top
CASE
33, airflow measurements comply with JEDEC stan-
JA
JMA
Table 33
. Values of
are provided for package comparison and printed
represents the thermal resistance under two
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not applicable
Not applicable
0 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
T
J
JA
T
=
J
in
JB
=
T
D
JB
represents the heat extracted from the
JT
J
Table 33
CASE
)
by the equation:
T
are provided for package compari-
represents the correlation between
Power Dissipation on Page 41
A
+
+
JA
is the figure of merit relating
JT
JA
P
D
can be used for a first
P
D
Typical
34.1
30.1
28.8
25.55
8.75
0.13
Typical
34.9
33.0
32.0
0.50
0.75
1.00
Rev. 0 | Page 45 of 56 | March 2004
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
for
ADSP-BF531/ADSP-BF532/ADSP-BF533
Table 35. Thermal Characteristics for B-169 Package
Parameter
JA
JMA
JMA
JB
JC
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not applicable
Not applicable
0 Linear m/s Airflow
Typical
28.6
24.6
23.8
21.75
12.7
0.78
Unit
C/W
C/W
C/W
C/W
C/W
C/W