RG82845M Intel, RG82845M Datasheet - Page 126

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RG82845M

Manufacturer Part Number
RG82845M
Description
Chipset Memory Controller Hub Mobile
Manufacturer
Intel
Datasheet

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Intel
6.
6.1.
6.2.
126
Warning: Stressing the device beyond the “Absolute Maximum Ratings” may cause permanent damage. These are
Table 34. Absolute Maximum Ratings
Table 35. Intel 845MP/845MZ Chipset MCH-M Package Thermal Resistance
®
82845MP/82845MZ Chipset-Mobile (MCH-M)
Thermal Characteristics
NOTE:
Electrical Characteristics
This chapter contains the absolute maximum operating ratings, power characteristics, and DC
characteristics for the 845MP/845MZ MCH-M.
Absolute Maximum Ratings
Table 34 lists the Intel 845MP/845MZ Chipset MCH-M maximum environmental stress ratings.
Functional operation at the absolute maximum and minimum is neither implied nor guaranteed.
Functional operating parameters are listed in the AC and DC tables.
stress ratings only. Operating beyond the “operating conditions” is not recommended and extended
exposure beyond “operating conditions” may affect reliability.
The Intel 845MP/845MZ Chipset MCH-M is designed for operation at die temperatures between 0°C
and 104°C. The thermal resistance of the package is given in Table 35.
T
T
T
VCC1_5
VCC1_8
VCCSM
VTT
V
(DDR)
Ψ
Θ
Symbol
die
die
storage
IL,
ja
jt
(°C/Watt)**
(°C/Watt)**
V
IH
** Typical value measured in accordance with EIA/JESD 51-2 testing standard.
Parameter
Die Temperature under Bias (with heatsink)
Die Temperature under Bias (without heatsink)
Storage Temperature
AGTL+ buffer DC input voltage with respect to Vss
Voltage on 2.5 V DDR tolerant input pins with
respect to Vss
1.5 V Supply Voltage with respect to Vss
1.8 V Supply Voltage with respect to Vss
2.5 V DDR Supply Voltage with respect to Vss
Parameter
Datasheet
Airflow Velocity in Meters/Second
0 m/s
20.0
0.5
-0.72
-0.88
-3.60
-0.55
-3.60
Min
-55
1 m/s
0
0
17.3
1.8
Max
2.69
6.30
104
150
2.5
6.3
2.3
98
Unit
°C
°C
°C
V
V
V
V
V
250687-002
Notes
R

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