MC9S12P64VQK Freescale Semiconductor, MC9S12P64VQK Datasheet - Page 506
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC9S12P64VQK
Manufacturer Part Number
MC9S12P64VQK
Description
16-bit Microcontrollers - MCU 16 BIT 64K FLASH
Manufacturer
Freescale Semiconductor
Datasheet
1.MC9S12P64VQK.pdf
(566 pages)
Specifications of MC9S12P64VQK
Rohs
yes
Core
S12
Processor Series
MC9S12P
Data Bus Width
16 bit
Maximum Clock Frequency
64 MHz
Program Memory Size
64 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
5 V
Operating Temperature Range
- 40 C to 105 C
Package / Case
QFP-80
Mounting Style
SMD/SMT
Interface Type
I2C, SCI, SPI
Program Memory Type
Flash
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12P64VQK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Electrical Characteristics
P
1. The values for thermal resistance are achieved by package simulations
2. Junction to ambient thermal resistance, θ
3. Junction to ambient thermal resistance, θ
506
Num
IO
10
11
12
13
14
15
horizontal configuration in natural convection.
horizontal configuration in natural convection.
1
2
3
4
5
6
7
8
9
R
R
is the sum of all output currents on I/O ports associated with V
DSON
DSON
P
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
INT
Thermal resistance QFN 48, single sided PCB
Thermal resistance QFN 48, double sided PCB
with 2 internal planes
Junction to Board QFN 48
Junction to Case QFN 48
Junction to Case (Bottom) QFN 48
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Thermal resistance LQFP 64, single sided PCB
Thermal resistance LQFP 64, double sided PCB
with 2 internal planes
Junction to Board LQFP 64
Junction to Case LQFP 64
Junction to Package Top LQFP 64
=
=
=
V
-------------------------------------- for outputs driven high
V
----------- - for outputs driven low
I
DD35
I
DDR
OL
OL
I
OH
;
–
⋅
V
V
DDR
OH
;
(3)
3
3
+
Table A-5. Thermal Package Characteristics
I
Rating
DDA
(4)
4
(6)
S12P-Family Reference Manual, Rev. 1.13
JA
JA
⋅
V
(5)
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
DDA
(7)
5
LQFP 64
QFN 48
QFP 80
2
(2)
2
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
DDX
, whereby
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
(1)
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
Max
1.4
82
28
11
56
43
28
19
70
52
35
17
4
5
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
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