S9S12G64F0CLFR Freescale Semiconductor, S9S12G64F0CLFR Datasheet - Page 1289
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
S9S12G64F0CLFR
Manufacturer Part Number
S9S12G64F0CLFR
Description
16-bit Microcontrollers - MCU S12 Core,64K FLASH AU
Manufacturer
Freescale Semiconductor
Datasheet
1.S9S12G96F0CLL.pdf
(1292 pages)
Specifications of S9S12G64F0CLFR
Rohs
yes
Core
S12
Processor Series
MC9S12G
Data Bus Width
16 bit
Maximum Clock Frequency
1 MHz
Program Memory Size
64 KB
Data Ram Size
8 KB
On-chip Adc
Yes
Operating Supply Voltage
3.13 V to 5.5 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-48
Mounting Style
SMD/SMT
A/d Bit Size
10 bit, 12 bit
A/d Channels Available
12
Interface Type
SPI
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
40
Number Of Timers
8
Program Memory Type
Flash
Supply Voltage - Max
5.5 V
Supply Voltage - Min
3.13 V
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Die Pad
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
Bond Post
MC9S12G Family Reference Manual, Rev.1.23
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
77
78
79
80
81
82
83
84
85
86
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
1707.5
1598.5
1477.5
1237.5
1117.5
947.5
777.5
652.5
527.5
422.5
327.5
242.5
Y Coordinate
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
Die Pad
1026.5
1133.5
1240.5
1347.5
-467.5
-360.5
-253.5
-148.5
172.5
279.5
386.5
493.5
598.5
705.5
812.5
919.5
-41.5
65.5
Function
PAD[10]
PAD[11]
PAD[12]
PAD[13]
PAD[14]
PAD[15]
PAD[9]
PAD[2]
PAD[3]
PAD[4]
PAD[5]
PAD[6]
PAD[7]
VDDA
VSSA
PC[4]
PC[5]
PC[6]
PC[7]
PD[0]
PD[1]
PD[2]
PD[3]
PS[0]
PS[1]
PS[2]
PS[3]
PS[4]
VRH
VRL
Package and Die Information
1291
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