HD64F3644DV Renesas Electronics America, HD64F3644DV Datasheet - Page 105

IC H8/3644 MCU FLASH 64QFP

HD64F3644DV

Manufacturer Part Number
HD64F3644DV
Description
IC H8/3644 MCU FLASH 64QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Lr
Datasheet

Specifications of HD64F3644DV

Core Processor
H8/300L
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3644DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Connecting a Ceramic Resonator: Figure 4.4 shows a typical method of connecting a ceramic
resonator.
Notes on Board Design: When generating clock pulses by connecting a crystal or ceramic
resonator, pay careful attention to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4.5.)
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC
To be avoided
OSC
OSC
Figure 4.4 Typical Connection to Ceramic Resonator
1
and OSC
Figure 4.5 Board Design of Oscillator Circuit
C
C
1
2
2
1
2
.
R
f
C
C
Signal A Signal B
1
2
R = 1 M
C = 30 pF ±10%
C = 30 pF ±10%
Ceramic resonator: Murata
1
2
f
Rev. 6.00 Sep 12, 2006 page 83 of 526
Section 4 Clock Pulse Generators
OSC
OSC
±20%
1
2
REJ09B0326-0600

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